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 L-NS
Vishay Thin Film
Low Value (0.03 to 10 ) Thin Film Chip Resistors
FEATURES
* Lead (Pb)-free or Sn/Pb terminations available * Homogeneous nickel alloy film * No inductance for high frequency application SURFACE MOUNT CHIPS
Pb-free Available
RoHS*
COMPLIANT
* Alumina substrates for high power handling capability (2 W max power rating) * Pre-soldered or gold terminations
Actual Size 0805
* Epoxy bondable termination available
With extremely low resistances and high power capabilities, VISHAY's proven and unique ultra-low value resistors can be used in your hybrid or surface mount applications. These resistors are available with solderable or weldable terminations.
TYPICAL PERFORMANCE
ABS TCR TOL 300 1.0
CONSTRUCTION VALUE AND MINIMUM TOLERANCE
Passivation Resistor Film Solder coating Nickel barrier High Purity Alumina Adhesion layer
VALUE () 0.1 0.25 0.5 1.0 2.0 10.0 < 0.1
MINIMUM TOLERANCE 2.0 % 1.0 % 1.0 % 1.0 % 1.0 % 1.0 % 20 %
STANDARD ELECTRICAL SPECIFICATIONS
TEST Case Sizes Resistance Range Absolute TCR Noise Power Rating SPECIFICATIONS 0505, 0705, 0805, 1005, 1020, 1206, 1505, 2010, 2515 0.03 to 10.0 300 ppm/C < - 30 dB typical up to 2.0 W at + 70 C - 55 C to + 125 C CONDITIONS
(Resistor values beyond ranges shall be reviewed by the factory)
CASE SIZE Power Rating - mW Min. Resistance - Max. Resistance -
0505 125 0.05 5.0
0705 200 0.10 6.0
0805 200 0.10 6.0
1005 250 0.15 10.0
1020 1000 0.03 3.0
1206 330 0.10 10.0
1505 500 0.25 10.0
2010 1000 0.17 10.0
2512 2000 0.18 10.0
* Pb containing terminations are not RoHS compliant, exemptions may apply www.vishay.com 58 For technical questions, contact: thin-film@vishay.com Document Number: 60027 Revision: 31-Jul-08
L-NS
Low Value (0.03 to 10 ) Thin Film Chip Resistors
Vishay Thin Film
DIMENSIONS in inches and millimeters
D
T
W
L
SIZE CASE SIZE L INCHES 0.005 0.050 0.050 0.050 0.200 0.063 0.050 0.100 0.125 W mm 0.13 1.27 1.27 1.27 5.08 1.60 1.27 2.54 3.18 INCHES MAX. 0.020 0.020 0.030 0.030 0.030 0.030 0.030 0.030 0.51 0.51 0.76 0.76 0.76 0.76 0.76 0.76 T mm INCHES mm + 0.010/- 0.005 + 0.25/- 0.13 0505 0.050 1.27 0805*, 0705* 0.075 1.91 1005 0.100 2.54 1020 0.100 2.54 1206 0.126 3.20 1505 0.150 3.81 2010 0.200 5.08 2512 0.250 6.35 D INCHES mm + 0.010/- 0.005 + 0.25/- 0.13 0.016 0.41 0.021 0.53 0.021 0.53 0.015 0.38 0.020 0.51 0.021 0.53 0.019 0.48 0.019 0.48
SURFACE MOUNT CHIPS
MECHANICAL SPECIFICATIONS
Resistive Element Substrate Material Terminals Lead (Pb)-free Option Lead (Pb)-free Finish Nickel Alloy Alumina Pre-soldered or gold 96.5 % Sn, 3.0 % Ag, 0.5 % Cu Hot Solder Dip
DERATING CURVE
100
Precent of Rated Power
80 60 40 20 0 0 70 125 150
ENVIRONMENTAL TEST
TEST Thermal Shock Short Term Overload Low Temperature Operation Resistance to Solder Heat Moisture Resistance High Temp. Exposure Load Life (2000 h at + 70 C) TCR 1 R % 0.06 0.06 0.03 0.05 0.35 0.35 0.40 235 ppm/C
Ambient Temperature C
GLOBAL PART NUMBER INFORMATION
New Global Part Numbering: L-1206M1R00GBT1 (preferred part number format)
L
GLOBAL MODEL L- = Low value wraparound chip resistor
CASE SIZE 0505 0805 1005 1020 1206 1505 2010 2512
1
2
0
6
OHMIC VALUE First 3 digits are significant figures and the last digit specifies the number of zeroes to follow. "R" designates the decimal point. Example: 0R10 = 0.1 1R60 = 1.6
M
1
R
0
0
G
B
T
1
TCR CHARACTERISTICS M = 300 ppm/C N = 350 ppm/C O = 400 ppm/C P = 500 ppm/C
TOLERANCE F=1% G=2% H=3% J=5% K = 10 % L = 20 %
TERMINATION B = Wraparound Sn/Pb solder 63 % Sn/37 % Pb w/ nickel barrier G = Wraparound Au over Ni (gold) termination epoxy bondable RoHS compliant - e4 W = Top side wire bondable Au (gold) RoHS compliant - e4 S = Wraparound lead (Pb)-free solder 96.5 % Sn/3.0 % Ag/0.5 % Cu RoHS compliant - e1
PACKAGING BS = BULK 100 Min 1 Mult WS = WAFFLE 100 Min 1 Mult TAPE AND REEL T0 = 100 Min 100 Mult T1 = 1000 Min 1000 Mult T3 = 300 Min 300 Mult T5 = 500 Min 500 Mult TF = Full Reel TS = 100 Min 1 Mult
Historical Part Number example: L1206M1R00HBT (will continue to be accepted) L STYLE 1206 CASE SIZE M TCR CHARACTERISTICS 1R00 OHMIC VALUE H TOLERANCE B TERMINATION T PACKAGING
Document Number: 60027 Revision: 31-Jul-08
For technical questions, contact: thin-film@vishay.com
www.vishay.com 59
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000 Revision: 18-Jul-08
www.vishay.com 1


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